Our Machines

Versatile and precise drilling
high throughput multipurpose
affordable precise drilling
affordable multipurpose
solar water scribing
custom

Versatile and Precise Drilling

Model #

NSI-UC2-3228 Gen III

General Info

Our Hybrid UV and CO2 laser system is a versatile laser processing solution ideal for recipe development and experimenting with new materials. This system is suitable for R&D and complex applications that require higher precision and more controlled laser processing capabilities. Our laser micromachining capabilities include via drilling, cutting, routing and skiving. 
 
The combined UV and CO2 laser system are perfect for PCB (printed circuit board) processing. The UV laser is ideally suited for fast and efficient drilling of copper layers whereas the CO2 laser is better suited for the acrylic layer of the PCB. Combined, the UV/CO2 provides a single step setup for drilling through multilayer PCBs.
 
NSI has perfected its hybrid system (laser drilling of both copper layer and dielectric composite materials) with an emphasis for user-friendliness. 

Key Features

Laser: 15w-20w UV and 3kw high peak power CO2

Max Panel Size: 32″ x28″

CCD camera vision

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High Throughput Multipurpose

Model #

UV-FLEX-DB

General Info

The NSI UV FLEX Dual Beam System is an advanced laser processing solution with high precision and volume FPC, LCP, COF production. Possessing high efficiency and optimal routing functions, this system is designed for fine feature laser routing. It comes with NSIconverter™️ software which converts drilling patterns to isolation routes. Additional micro-machining capabilities include cutting, depanelling, microvia drilling, scribing and skiving.

Key Features

Laser Source: 10w-20w UV laser

NSIconverter TM to generate optimal isolation routing.

Capable of processing 15/15 line/space fine feature.

Advance optics design to enable 50/50 Beam Split to double processing throughput.

Max working area: 20″ x 24″

CCD camera vision

Option with Roll-to-Roll automation for higher throughput

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Affordable Precise Drilling

Model #

NSI-UV-2125

General Info

NSI UV Drilling Machine is an affordable single laser system made for mass production. The system is suitable for high throughput and high yield applications that require accurate, clean, and high quality through holes and blind vias. Additional micro-machining capabilities include cutting, depanelling, routing, and skiving.
 
Our UV drilling machine is configurable with different laser options (nano or pico second).

Key Features

Laser source: 15W, UV laser technology
 
Max panel size: 21” x 25”
 
Configurable with different laser options (nano or pico laser)
 
Automated or Semi-auto loading and unloading option for higher throughput
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Affordable Multipurpose

Model #

UV-FLEX-500

General Info

The NSI UV-FLEX-500 series is an affordable laser processing solution best for mass production. The system is suitable for high throughput and high yield applications that require multiple laser processes include via drilling, cutting, depanelling, routing, and skiving.

Key Features

Laser Source: 10w-20w UV laser

Max working area: 20″ x 24″

CCD camera vision

Option with Roll-to-Roll automation for higher throughput

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High Speed Solar Wafer Scribing

Model #

NSI-GWS-170S

General Info

The NSI-GWS-170S laser system is designed for PERC cell back scribing process and other micromachining processes such as drilling, skiving, and scribing. It can be used as a standalone system or be integrated into an inline mass production line.

The NSI laser system capabilities include:

  • Scribing lines and patterns ranging from 25μm – 60μm
  • Skiving of fiducial marks for drill file registration
  • Light scribing of different substrate 
  • Drilling of holes with diameters 

Key Features

Laser source: 25w green

Max wafer size: 170mm x170mm

Table Configuration: Specialized wafer grabbing hand with 90-180 degree rotation for precision and protection

High Speed Scanning Devices: High-speed galvo scanning at ≥25m/s

CCD imaging system for precise posting and process quality control.

Load/Unload Automation: Inline or Stacked Loading/Unloading

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Custom

Model #

Customize Laser System

General Info

Our standard laser systems usually provide the most cost effective solutions for our customers. However, if you have special functionalities, NSI Laser also designs and builds customized laser systems. Most often with a new customer, we start with a customized process development that’s carried out on one of our experimental system setups in our applications lab. If such a unique process cannot be implemented on one of our standard laser systems, we would offer to build a customized system. This might involve the use of ultra fast lasers (pico or femto), a unique loading/unloading mechanism that cannot fit into our standard laser system, or any other customized feature. Please discuss with one of our laser experts regarding your customized system needs at info@nsilaser.com.

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