NSI Laser showcase at IPC APEX EXPO 2020

THANK YOU  for visiting our booth and discuss your applications at IPC APEX EXPO during Feb 2-6, 2020. We are very pleased to showcase our latest innovations in fine feature laser processing for laser drilling and circuit patterning. Here is the recap of our new exciting offering!

15 MICRON FINE FEATURE?

CHECK OUR NEWEST MODEL

UV-FLEX-DB

  • Advance optics design to enable 12 micron beam size for 15/15 line/space fine feature processing.
  • NSIconverter  to generate optimal isolation routing.
  • 50/50 Beam Split to double processing throughput.
  • Optional Roll-to-Roll automation.
  • Typical Material: Copper foil, LCP, PI, COF, etc.

Processing Samples

Microvias

15/15 line & spacing

Pattern routing

Cross Section

Contact us

NSI Laser showcase at IPC APEX EXPO 2020

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